【英文标准名称】:Solderlessconnections;solderlesscrimpedconnections;generalrequirements,testmethodsandpracticalguidance;identicalwithIEC352-2:1990
【原文标准名称】:无焊连接.第2部分:无焊压接连接.一般要求.试验方法和实用指南
【标准号】:DINIEC60352-2-1992
【标准状态】:作废
【国别】:德国
【发布日期】:1992-04
【实施或试行日期】:
【发布单位】:德国标准化学会(DIN)
【起草单位】:
【标准类型】:()
【标准水平】:()
【中文主题词】:无钎焊连接;压接连接;推荐应用;夹持装置;试验类别;检测点;材料;载流量;表面;电气工程;电阻率;尺寸;试验;规范(批准);定义;绝缘
【英文主题词】:insulations;surfaces;resistivity;specification(approval);crimp-connections;testcategories;checkpoint;materials;currentcarryingcapacity;solderlessconnections;definitions;electricalengineering;re
【摘要】:
【中国标准分类号】:L23
【国际标准分类号】:29_120_20
【页数】:30P;A4
【正文语种】:德语


Product Code:SAE AMS3690
Title:Adhesive Compound, Epoxy, Room Temperature Curing
Issuing Committee:Ams P17 Composite Materials Committee
Scope:This specification covers a two-component compound, an epoxy resin base and a hardener, in the form of a paste.This adhesive compound has been used typically for nonstructural bonding of metallic alloys and thermosetting plastics to themselves and to each other; it is intended primarily as an adhesive for electrical components operating at not higher than 185 °F (85 °C), but usage is not limited to such applications.